Thermal Analysis – Component Layout

Careful arrangement of components within an enclosure can reduce hot spots. Since heat rises, high heat generating components, such as the variable frequency drive, should be mounted near the bottom of the enclosure.

Heat sensitive components should not be placed directly above the variable frequency drive.

It’s best to keep heat sensitive equipment well away from heat generating components such as VFDs. In turn, VFDs need an adequate flow of cool air and the hot air discharged should be directed back to the enclosure cooling system or through vents.

In an ideal world, VFDs would be separated from other equipment, but this is not practical and care must be taken to ensure the heat generated by these drives does not adversely affect other equipment. It is advantageous to place these units as close to the enclosure cooling system as is practical to maximize cooling and to minimize the risk of overheating sensitive equipment.